Abstract: . . .  which have been realized for ceramic substrates applications. Figure 6 shows a ceramic product with these improvements. Figure 6. Key elements of flip chip on ceramic assembly for automotive application. CONCLUSIONS It is extremely important for progressive electronics automotive companies to have a clear vision of future products. This vision , through the use of a defining process, is used to generate technology roadmaps that identify technology development projects. These projects enable product vision realization through innovative product designs. Technologies developed can be used, or reused, on other new or existing product designs, which results in expanded benefits from the new design rules and manufacturing processes developed. ACKNOWLEDGEMENTS The authors of this paper would like to thank Dr. Robert Schumacher, Product Line Executive for Mobile Multi- Media at Delphi Delco Electronics, and Dr. Richard Lind, Director of Advanced Engineering at Delphi Delco Electronics, for their inputs . . .
. . .  Delheimer, “Adding Flip Chip Placement Capabilities to a SMT Manufacturing Process is NOT Difficult, Even in High Volume,” Intl. Conf. on Elect. Assy.: Materials and Process Challenges (IEEE Press, 1998), pp. 39-48. 5. S. Brandenburg and J. Daanen, “Thermal Reliability Characteristics of Top-Side Flip Chip Heat Sinking Method,” IMAPS Intl. Sys. Packaging Symp ., (IMAPS 1999), pp.139-145. Flip Chip IC Packaging • Solder Bumping T Known Good Die Substrate Technology T Ceramic Thick Film T Fine Geometries Thermal Management T Through Substrate Heat Removal Manufacturing Process T Placement and Soldering T Underfill Dispense and Cure T Robust Assembly Encapsulation  . . .
. . .  Structure Thermal Management T Through Substrate Heat Removal Manufacturing Process T Placement and Soldering T Underfill Dispense and Cure T Wave Soldering Page 7 5 few of the enhancements which have been realized for ceramic substrates applications. Figure 6 shows a ceramic product with these improvements. Figure 6. Key elements of flip chip on ceramic assembly for automotive application. CONCLUSIONS It is extremely important for progressive electronics automotive companies to have a clear vision of future products. This vision , through the use of a defining process, is used to generate technology roadmaps that identify technology development projects. These projects enable product vision realization through innovative product designs. Technologies developed can be used, or reused, on other new or existing product designs, which results in expanded benefits from the new design rules and manufacturing processes developed. ACKNOWLEDGEMENTS The authors of this paper would like to thank Dr. Robert . . .
--3000,3,500,2912,20541